Experimental study of thermal field deriving from an underground electrical power cable buried in non-homogeneous soilsVOLLARO, Roberto de Lieto; FONTANA, Lucia; VALLATI, Andrea et al.Applied thermal engineering. 2014, Vol 62, Num 2, pp 390-397, issn 1359-4311, 8 p.Article

Thermal spreading resistance characteristics of a high power light emitting diode moduleYANG, Kai-Shing; CHUNG, Chi-Hung; TU, Cheng-Wei et al.Applied thermal engineering. 2014, Vol 70, Num 1, pp 361-368, issn 1359-4311, 8 p.Article

Thermal resistance in conductive constructal designs of arbitrary configuration: A new general approachESLAMI, M; JAFARPUR, K.Energy conversion and management. 2012, Vol 57, pp 117-124, issn 0196-8904, 8 p.Article

Thermal optimization of a construction of a double-heterostructure GaAs/(AlGa)As diode laserKORZENIOWSKI, A; NAKWASKI, W.Journal of thermal analysis. 1990, Vol 36, Num 3, pp 1039-1047, issn 0368-4466Article

A multi-artery vapor chamber and its performanceYONG TANG; DONG YUAN; LONGSHENG LU et al.Applied thermal engineering. 2013, Vol 60, Num 1-2, pp 15-23, issn 1359-4311, 9 p.Article

Three-dimensional conjugate heat transfer in partitioned enclosures: Determination of geometrical and thermal properties by an inverse methodGOSSARD, Didier; LARTIGUE, Berangere.Applied thermal engineering. 2013, Vol 54, Num 2, pp 549-558, issn 1359-4311, 10 p.Article

Thermal performance of pulsating heat pipes with different heating patternsWANG JIANSHENG; WANG ZHENCHUAN; LI MEIJUN et al.Applied thermal engineering. 2014, Vol 64, Num 1-2, pp 209-212, issn 1359-4311, 4 p.Article

Experimental studies of thermal resistance in a vapor chamber heat spreaderTSAI, Meng-Chang; KANG, Shung-Wen; VIEIRA DE PAIVA, Kleber et al.Applied thermal engineering. 2013, Vol 56, Num 1-2, pp 38-44, issn 1359-4311, 7 p.Article

Thermal analysis of loop heat pipe used for high-power LEDLU, Xiang-You; HUA, Tse-Chao; LIU, Mei-Jing et al.Thermochimica acta. 2009, Vol 493, Num 1-2, pp 25-29, issn 0040-6031, 5 p.Article

Characterization of working fluid in vertically mounted finned U-shape twin heat pipe for electronic coolingELNAGGAR, Mohamed H. A; ABDULLAH, M. Z; ABDUL MUJEEBU, M et al.Energy conversion and management. 2012, Vol 62, pp 31-39, issn 0196-8904, 9 p.Article

Influence coefficient method for calculating discrete heat source temperature on finite convectively cooled substratesMUZYCHKA, Y. S.InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. 2004, isbn 0-7803-8357-5, Vol1, 394-402Conference Paper

Narrow channel forced air heat sinkGOLDBERG, N.IEEE transactions on components, hybrids, and manufacturing technology. 1984, Vol 7, Num 1, pp 154-159, issn 0148-6411Article

Action de l'eau sur la dégradation d'un revêtement émaillé pendant l'étude de sa thermostabilitéBEDNOSHEYA, V. YA; KOVAL, V. M; VYAL'TSEVA, N. YA et al.Steklo i keramika. 1984, Num 2, pp 17-18, issn 0131-9582Article

Calcul de la résistance thermique d'une contractionOSITINSKAYA, T. D.Inženerno-fizičeskij žurnal. 1984, Vol 47, Num 1, pp 167-168, issn 0021-0285Article

In situ measurement of the thermal resistance of building envelopes of office buildingsFANG, J. B; GROT, R. A.ASHRAE transactions. 1985, Vol 91, Num 1, pp 543-557, issn 0001-2505Article

An average fluid temperature to estimate borehole thermal resistance of ground heat exchangerCIYUAN DU; YOUMING CHEN.Renewable energy. 2011, Vol 36, Num 6, pp 1880-1885, issn 0960-1481, 6 p.Article

The longwave radiative heat transfer of the building envelopesNOWAK, H.Infrared physics. 1991, Vol 32, pp 357-363, issn 0020-0891Article

Evaluating the thermal strength of refractory materials on the basis of the failure temperature gradientTSIBIN, L. P; KORTEL, A. A; KUZNETSOV, A. T et al.Refractories (New York). 1983, Vol 24, Num 3-4, pp 152-155, issn 0034-3102Article

Experimental determination of the thermal resistance insulationsHOLLINGSWORTH, M. JR.ASHRAE transactions. 1983, Vol 89, pp 568-578, issn 0001-2505, 1BArticle

Improvement of thermosyphon performance by employing nanofluidBUSCHMANN, Matthias H; FRANZKE, Uwe.International journal of refrigeration. 2014, Vol 40, pp 416-428, issn 0140-7007, 13 p.Article

The epoxy-siloxane/Al composite coatings with low infrared emissivity for high temperature applicationsCHEN HU; GUOYUE XU; XINGMEI SHEN et al.Applied surface science. 2010, Vol 256, Num 11, pp 3459-3463, issn 0169-4332, 5 p.Article

Thermal analysis of high power GaN-based LEDs with ceramic packageLIANQIAO YANG; SUNHO JANG; HWANG, Woongjoon et al.Thermochimica acta. 2007, Vol 455, Num 1-2, pp 95-99, issn 0040-6031, 5 p.Conference Paper

Increased Water Activity Reduces the Thermal Resistance of Salmonella enterica in Peanut ButterYINGSHU HE; YE LI; SALAZAR, Joelle K et al.Applied and environmental microbiology (Print). 2013, Vol 79, Num 15, pp 4763-4767, issn 0099-2240, 5 p.Article

Evaluation of heat exchange rate of GHE in geothermal heat pump systemsLIU JUN; ZHANG XU; GAO JUN et al.Renewable energy. 2009, Vol 34, Num 12, pp 2898-2904, issn 0960-1481, 7 p.Article

Variable thermal resistor based on self-powered Peltier effectGAO MIN; YATIM, N. Md.Journal of physics. D, Applied physics (Print). 2008, Vol 41, Num 22, issn 0022-3727, 222001.1-222001.3Article